PCB Design Services

PCB Design Services

From Single Layer to 34 Layer Complex Multilayer Boards

World-Class PCB Design Expertise

At Black Stick, we deliver professional PCB design services that meet the most demanding requirements across space, defence, industrial, and commercial sectors. Our engineers combine decades of experience with cutting-edge design practices to ensure your boards are optimised for performance, manufacturability, and reliability.

Single to Multilayer Designs

  • Single layer - Cost-effective solutions
  • 2-4 layers - Standard commercial products
  • 6-12 layers - Complex digital and mixed-signal
  • 14-34 layers - Advanced high-speed and RF systems
  • Buried capacitance and resistance layers

Advanced Technologies

  • HDI (High-Density Interconnect)
  • Microvia technology (laser drilled)
  • Blind and buried vias
  • Sequential lamination
  • Via-in-pad and back-drilling
  • Flex and rigid-flex PCB

Signal Integrity

  • Controlled impedance routing (50Ω, 75Ω, 90Ω, 100Ω)
  • Differential pair design (USB, HDMI, PCIe, LVDS)
  • High-speed digital (multi-gigabit)
  • Length matching and delay tuning
  • Serpentine routing and phase matching
  • Crosstalk and EMI/EMC mitigation

RF & Microwave

  • RF circuit board design (DC to 40+ GHz)
  • Microstrip and stripline design
  • Impedance-controlled transmission lines
  • Ground plane optimisation
  • RF shielding and isolation
  • Antenna integration

Power & Thermal

  • High-current power distribution
  • Copper balancing and plating
  • Thermal management and heat sinking
  • Power plane design and decoupling
  • Voltage drop analysis
  • Heavy copper (up to 10oz)

Design for Manufacturing

  • DFM rule checking and optimisation
  • Fabrication documentation (Gerbers, NC drill, IPC-2581)
  • Assembly drawings and BOM generation
  • Test point placement and JTAG
  • Panel optimisation for production
  • Manufacturer liaison and approval

Industry Applications

Space & Satellite

Radiation-hardened designs, thermal cycling considerations, outgassing requirements, and stringent reliability standards for LEO, MEO, and GEO satellite systems.

Defence & Military

Ruggedised electronics, vibration and shock resistance, extended temperature ranges, conformal coating compatibility, and compliance with military standards (MIL-STD).

Medical Devices

IPC-Class 3 manufacturing, biocompatible materials, FDA compliance considerations, high reliability for life-critical applications, and EMC compliance for medical environments.

Industrial Control

Robust designs for harsh environments, wide temperature operation, noise immunity, long product lifecycles, and compliance with industrial standards (IEC, UL).

Telecommunications

High-speed digital interfaces, backplane design, impedance-controlled routing, EMI/EMC compliance, and optimisation for volume production.

Automotive Electronics

AEC-Q qualification support, thermal management for under the bonnet (under-hood) applications, vibration resistance, and compliance with automotive standards (ISO 26262).

Our Design Process

1

Requirements Review

We begin by thoroughly understanding your technical requirements, constraints, and objectives. This includes schematic review, component selection, technology constraints, and manufacturing targets.

2

Stack-up Design

We define the optimal layer stack-up considering signal integrity, power distribution, manufacturing capabilities, and cost targets. This includes impedance calculations and material selection.

3

Component Placement

Strategic component placement optimises signal flow, minimises trace lengths, manages thermal hotspots, and ensures manufacturability and testability.

4

Routing & Optimisation

Manual routing of critical signals (high-speed, RF, power) with careful attention to impedance control, length matching, and EMI mitigation. Design rule checking ensures manufacturability.

5

Verification & Review

Comprehensive design verification including DRC, electrical rule checking, signal integrity simulation, and formal design review with your team.

6

Manufacturing Release

Complete fabrication package including Gerber files, drill files, assembly drawings, BOM, and test specifications. We coordinate with your chosen manufacturer for approval and optimisation.

Ready to Start Your PCB Design Project?

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